---
title: "China Unveils FlintNano EUV Source Prototype: 3–5 Years Away from Mass Production"
description: "China's Langdao Silex has introduced the FlintNano LPP-OXXO EUV source prototype with an output power exceeding 15 W. The company will need 3–5 years of engineering refinement before mass production."
date: 2026-10-17T02:47:52.214Z
lang: en
url: https://xab.info/en/posts/china-unveils-flintnano-euv-source-prototype
tags: [china, euv-lithography, semiconductors, langdao-silex, asml, chip-manufacturing]
author: "Alexander Buran"
publisher: "XAB.info"
---

# China Unveils FlintNano EUV Source Prototype: 3–5 Years Away from Mass Production

![FlintNano LPP-OXXO EUV source prototype by Langdao Silex on display](https://xab.info/media/2026/10/17/kitay-pokazal-prototip-euv-istochnika-flintnano-do-seriynogo-proizvodstva-3-5-let/kitay-pokazal-prototip-euv-istochnika-flintnano-do-seriynogo-proizvodstva-3-5-let-1.webp)

## Key Points

- Langdao Silex publicly demonstrated the FlintNano LPP-OXXO EUV source prototype at a fair in Shanghai
- The prototype's output power exceeds 15 W, which is significantly below industrial standards of hundreds of watts
- Mass production will take the company 3 to 5 years
- 90% of components are made in China, and the project is led by a former ASML employee
- China is already producing DUV systems, with deliveries expected in 2026

Chinese technology company Langdao Silex has publicly demonstrated a prototype of its own extreme ultraviolet (EUV) light source for EUV lithography for the first time. The presentation of the FlintNano LPP-OXXO system took place at the 26th China International Industry Fair in Shanghai. According to company representatives, about 90% of the system's components are manufactured in China, and most key assemblies were developed directly within Langdao Silex. The team behind the project includes a former ASML Holding employee, underscoring the strategic importance of the development for the Chinese semiconductor industry.

### Prototype Technical Specifications

The FlintNano LPP-OXXO system is built on laser-produced plasma (LPP) technology: a high-power laser targets microscopic tin droplets, turning them into plasma that emits radiation with a wavelength of about 13.5 nm. According to specifications published by Langdao Silex, the driving laser has a power of 1000 W, the pulse repetition rate is 1–20 kHz, and energy conversion efficiency exceeds 2%. The claimed EUV output power is over 15 W, with a brightness of 100 W/(mm²·sr). The company also indicates continuous operation capability of over 100 hours, a plasma area size of 60 µm, plasma stability of 3% RMS, and energy stability of 5%. Notably, several specialized publications, citing data from Chinese researchers, cite an energy conversion efficiency of around 3.4%, which slightly exceeds the figure announced at the presentation.

### Gap with Industrial Standards

A significant gap remains between the capabilities of Langdao Silex's prototype and the requirements for commercial EUV systems. Industrial lithographic systems require light sources with powers of several hundred watts capable of stable long-term operation. For comparison, ASML achieved an EUV source power of 250 W back in 2018, which enabled the transition to mass production of chips using EUV lithography. In April 2025, the Dutch company demonstrated a 1000 W source, though its commercial deployment also requires further engineering work. Thus, the 15 W claimed by Langdao Silex remains at the level of a laboratory prototype rather than an industrial solution.

### Roadmap and Key Challenges

Langdao Silex states that technological feasibility has been proven for the high-power FlintMicro-LPP series, while the low-power FlintNano-LPP series is in the product development stage. Nevertheless, according to the company's own estimates, full-scale commercial production is three to five years away. The main challenges lie in increasing output power and improving long-term operational stability. In addition to the light source itself, creating a competitive EUV system will require precision optics, high-accuracy wafer positioning mechanisms, and complex system integration. ASML's systems consist of hundreds of thousands of components supplied by over 800 companies worldwide—an ecosystem that cannot be replicated overnight.

### Context: DUV Already in Production, EUV is the Next Step

It was previously reported that China has already established production of less advanced lithographic systems operating in deep ultraviolet (DUV), with deliveries to major local chipmakers expected in 2026. EUV remains a significantly more complex challenge requiring progress across a range of critical subsystems. For ASML, China is an important market, accounting for about 20% of the Dutch manufacturer's annual revenue. At the same time, analysts estimate that ASML is more concerned about potential new U.S. sanctions than the current level of Chinese developments in EUV lithography. However, the public demonstration of Langdao Silex's prototype marks a symbolic step confirming that China is steadily closing the technological gap in one of the semiconductor industry's most critical spheres.

## Accounts differ

### EUV Source Energy Conversion Efficiency

- **Langdao Silex (according to 3dnews.ru):** Energy conversion efficiency exceeds 2% ([3dnews.ru](https://3dnews.ru/1149991/kitay-pokazal-sobstvenniy-istochnik-euvizlucheniya-dlya-vipuska-peredovih-chipov-do-seriynogo-proizvodstva-eshchyo-35-let))
- **Langdao Silex Researchers (according to ixbt.com):** Energy conversion coefficient is about 3.4% ([ixbt.com](https://www.ixbt.com/live/offtopic/kitay-priblizilsya-k-sobstvennoy-euv-litografii-byvshiy-sotrudnik-asml-pomog-v-razrabotke-klyuchevyh-elementov.html))

*Where they agree:* Langdao Silex presented the FlintNano LPP-OXXO EUV source prototype at the Shanghai fair; all sources confirm the demonstration and the LPP technology.

## Fact-Check & Sources

- [Китай показал собственный источник EUV-излучения для выпуска передовых чипов — до серийного производства ещё 3–5 лет window-new](https://3dnews.ru/1149991/kitay-pokazal-sobstvenniy-istochnik-euvizlucheniya-dlya-vipuska-peredovih-chipov-do-seriynogo-proizvodstva-eshchyo-35-let) - Primary source. All basic technical characteristics and statements by Langdao Silex are taken from this material.
- [Китайский стартап показал источник экстремального ультрафиолетового излучения для ...](https://shazoo.ru/2026/10/16/192530/kitaiskii-startap-pokazal-istocnik-ekstremalnogo-ultrafioletovogo-izluceniia-dlia-proizvodstva-mikrocipov-s-lokalizaciei-90) - Confirms the presentation venue (Shanghai, China International Industry Fair), 90% localization rate, LPP technology, and China's share of ASML's revenue (~20%).
- [Китай разработал ключевой компонент для суверенной EUV-литографии — помог бывший инженер ASML](https://3dnews.ru/1146606/kitay-razrabotal-klyuchevoy-komponent-dlya-suverennoy-euvlitografii-pomog-bivshiy-ingener-asml) - Первоисточник. Все основные технические характеристики и заявления Langdao Silex взяты из этого материала.
- [Китай приблизился к собственной EUV-литографии: бывший сотрудник ASML помог в разработке ключевых ...](https://www.ixbt.com/live/offtopic/kitay-priblizilsya-k-sobstvennoy-euv-litografii-byvshiy-sotrudnik-asml-pomog-v-razrabotke-klyuchevyh-elementov.html) - Confirms the participation of a former ASML employee. Cites an efficiency of ~3.4%, which diverges from the >2% figure in the primary source.

## FAQ

### What is EUV lithography and why is it needed?

EUV lithography is a technology for printing ultrafine features onto silicon wafers using extreme ultraviolet radiation (wavelength ~13.5 nm). It is required for manufacturing chips at the most advanced process nodes (7 nm and below). Mass production of modern high-performance processors is impossible without EUV equipment.

### How close is the Langdao Silex prototype to industrial level?

It lags significantly behind. The prototype's output power is over 15 W, whereas industrial EUV systems require light sources rated at several hundred watts. ASML reached 250 W back in 2018. Furthermore, commercial systems require precision optics, positioning mechanisms, and the integration of hundreds of thousands of components.

### When will China be able to mass-produce EUV systems?

According to Langdao Silex's own estimates, full-scale commercial production is three to five years away. This refers only to the light source—just one of many subsystems in a lithographic machine. Building a complete EUV machine will take considerably longer.

### What technology is used in FlintNano LPP-OXXO?

The system is based on laser-produced plasma (LPP) technology: a 1000 W laser targets microscopic tin droplets, turning them into plasma that emits EUV radiation. This is the exact same principle used in ASML systems.