Xiaomi 18 Fold — foldable flagship powered by its own 3nm Xring O3 chip

Red Xiaomi 18 Fold smartphone: rear panel with camera module and unfolded inner display

The image shows a red Xiaomi foldable smartphone: on the left is the rear panel with an oval camera island and the brand logo, on the right the unfolded inner display with petal-style wallpaper. This device is reportedly set to debut Xiaomi's in-house 3nm Xring O3 chip, taking on Qualcomm.

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