Internal Qualcomm documents, which came into the possession of Notebook Check and were reported by RBC-Ukraine, confirm that Samsung is already actively testing the Galaxy S27 series based on the not-yet-released flagship chipset. Three parallel project entries are registered in the company's database, each tied to the software distribution package "Snapdragon_Premium_High_2026" — Qualcomm's internal designation for upcoming flagship processors. This means that the next-generation hardware platform has already passed the initial silicon subsystem bring-up and has moved on to testing radio-frequency modules and software.
Three regional builds under the codename SM8975
According to Notebook Check data, three separate project variants are currently registered, being developed in parallel under the chipset codename SM8975. The first entry — SS_SM8975_GS27_AP — is a build intended for the Asia-Pacific region. The second, SS_SM8975_GS27_KOR, is a special version of the device for the South Korean home market. The third modification, SS_SM8975_GS27_VZW, was created to meet the requirements of the American mobile carrier Verizon. The presence of a separate build for Verizon indicates that the certification process for the US market is already actively underway.
What stage is development at
Launching three parallel regional and carrier builds at this stage is consistent with the standard pre-release testing process. According to developers, this configuration is necessary to ensure that the device meets the requirements of specific telecom operators in different jurisdictions. The transition from the initial silicon platform bring-up to testing radio-frequency modules and software indicates that the project is at a fairly advanced stage: the basic operation of the processor has already been confirmed, and engineers are focused on compatibility with cellular networks, navigation modules, and firmware.
Snapdragon Summit and release timeline
The official announcement of the new processor is coming very soon. Qualcomm plans to present the flagship Snapdragon 8 Elite Extreme Gen 6 chipset together with the standard Snapdragon 8 Elite Gen 6 version at the annual Snapdragon Summit event, scheduled for September 22–24, 2026, and to be held in Hawaii. Traditionally, the Samsung Galaxy S smartphone line is released a few months after the presentation of new Qualcomm chips. The official unveiling of the new flagships at the Galaxy Unpacked event and their availability in retail usually fall in the first quarter of the following year, i.e., March–April 2027.
What this means for the market
The confirmation of parallel development of three regional versions of the Galaxy S27 on a not-yet-announced chipset is a strong signal that Samsung is not changing its plans to move to the Snapdragon platform in its top-tier line. For consumers, this means that in just a few weeks at Snapdragon Summit the full processor specification will be revealed, and the final technical specifications of the Galaxy S27 Ultra — including the camera, battery, and display — will be disclosed closer to Galaxy Unpacked. Thus, the window between the official chip announcement and the start of smartphone sales will be around six months, which is consistent with the established model of interaction between the two companies.
