#Chipset

Huawei has reported the first successful tests of its LogicFolding architecture: the upcoming Kirin processor for 2027 is already meeting the company's internal goals despite restricted access to advanced manufacturing technologies.

Apple is developing a corporate AI server based on M8 Ultra chips with integration of Nvidia's NVLink Fusion. Launch is possible in 2029; the project is in its early stages and could be cancelled.

The Apple A20 Pro on the 2-nm process achieved a memory bandwidth of 115.2 GB/s on LPDDR5X, surpassing the Xiaomi XRING 03 with LPDDR6 (113.8 GB/s) thanks to a six-channel bus.

Internal Qualcomm documents have confirmed parallel testing of three regional builds of the Samsung Galaxy S27 on the SM8975 chipset. The official announcement of the Snapdragon 8 Elite Extreme Gen 6 is expected at Snapdragon Summit on September 22–24, 2026.

The first detailed image of the Apple A20 Pro chip die has been published online: seven GPU cores, a six-core CPU, and a 96-bit memory bus. The debut is expected in the iPhone 18 Pro and the first foldable iPhone.