#Hbm

Samsung is preparing the test launch of its Taylor (Texas) semiconductor plant for the second half of December 2026, with mass production of 2nm chips, including processors for Tesla, scheduled for 2027.

TSMC is considering raising CoWoS packaging prices for AI chips by 10–20% due to capacity shortages and surging demand. No official confirmation has been made yet.

SK hynix reported a record third quarter: revenue exceeded 100 trillion won ($78.1 billion), operating profit rose more than sevenfold, and profitability reached 80%. The company projects a memory shortage until 2030 and prepares to bring HBM4 to the forefront.

Broadcom secured NVIDIA-level memory prices from Samsung and allocated up to $42 billion to fund Anthropic's AI infrastructure development.

According to Edgewater Research, NVIDIA has signed multi-year agreements with SK hynix and Micron for DRAM and HBM supply amid a global memory shortage that, by estimates, may last until 2028.

In August 2026, Samsung raised prices for contract production of 4-nm and 5-nm chips by 10–15%, monetizing the global capacity shortage. Against the backdrop of full utilization of lines in Pyeongtaek and new customers, the company's foundry business may turn profitable as early as 2027.